Advanced micro soldering
Quick, Reliable, and Affordable o Advanced micro soldering repair techniques
When standard repair stops working, precision takes over. Our advanced micro soldering repair techniques bring dead and damaged devices back to life. We perform intricate PCB (Printed Circuit Board) work under high-magnification microscopes, restoring broken traces, replacing microscopic IC components, and rebuilding power and communication lines. From smartphones and tablets to laptops and game consoles, we handle the most complex board-level repairs — including CPU/GPU reballing, PMIC and Tristar replacement, and connector or circuit reconstruction. Using professional-grade tools, heat-controlled stations, and microscope-guided precision, we restore functionality that others call impossible. Whether it’s a shorted voltage rail, water-damaged logic board, or failed Face ID circuit, our micro soldering expertise gives your device a second life — efficiently, safely, and with unmatched accuracy.
Component-Level Soldering
This involves repairing or replacing small components on acircuit board, such as resistors, capacitors, and integrated circuits (ICs). ○ BGA (Ball Grid Array) Rework: Replacing BGA components, which are often difficult due to their small ball-solder connections. ○ QFN (Quad Flat No-lead) Soldering: Rework on QFN components is challenging because of their leads under the package.
Desoldering
The process of removing components or faulty solder joints without damaging surrounding components. ○ Hot Air Rework Stations: Used to remove components that are surface-mounted. ○ Soldering Iron with Desoldering Tip: Often used for smaller components and precise desoldering.
PCB Repair
○ PCB Traces Repair: If a trace on the PCB is damaged (often by heat or physical impact), it can be repaired using solder bridges or wire. ○ Via Repair: A via in a PCB that has failed (e.g., due to a broken connection) can be repaired by running a wire or jump wire to bridge the broken connection.
Micro Soldering Tools
○ Hot Air Rework Station: Essential for heat-sensitive components. ○ Soldering Iron with Precision Tips: These allow for extremely fine work, making them ideal for surface-mounted components. ○ Microscopes: Used for better visual inspection of the work, since components can be as small as a few millimeters.
Reballing
The process of applying new solder balls to BGA components to fix soldering issues or to replace the part entirely.
Solder Paste and Flux
Using high-quality flux and solder paste is important for successful micro-soldering, as it helps in getting good solder joints without bridging pins.
PCB Cleaning
After repairs, the board needs to be cleaned of flux residue, as flux can corrode the board over time